V6 ACADEMIA Learn, Work and Play in 3D

Dassault Systèmes (3DS) provides the V6 academic world with learning opportunities for all ages in the latest 3D and PLM technology; from the early discovery of 3D at primary schools through a more sophisticated PLM knowledge at secondary schools and universities. 3DS promotes the advancement of excellence in all aspects of engineering, engineering technology and design while fostering innovative student projects and professors’ educational practices.

With Dassault Systemes solutions, it will help to turn students’ skills into the engineering job of their dreams. It enables a rich and interactive learning experience while creating new teaching, research and partnership opportunities.

3D Modeling Applications.

Dassault Systèmes provides V6 academia with the same 3D modeling applications that have transformed industry practices – from Digital Mockups to Product Lifecycle Management (PLM). These resources offer a broad range of design possibilities and enhance graduates’ employability by giving them realistic industrial experience and up-to-date skills.

Social and Collaborative Applications.

Collaborative and social media tools are part of today’s innovation process. Working together across dispersed, connected teams requires dedicated software.
Let’s surprise and engage your digitally native students with:

  • Inter-disciplinary learning environment, combining broad subsets of all Dassault Systèmes PLM software.
  • Designed to enable collaboration, design in context, work package-based engineering and many other industry required practices.
  • Ubiquitous home working and student contribution traceability with robust control tools.

Content and Simulation Applications.

Connecting the real and virtual world requires scientific simulation. Dassault Systèmes provide a full range of applications for all educational and research situations, from interactive 3D course material to sophisticated physics simulation tools. This enhances the virtual environments with new levels of 3D portability and simulation capabilities.